Union Minister Ashwini Vaishnaw said SEMICON 2.0 will target at least 200 startups and companies designing chips in India. The next phase will also focus on semiconductor machines and materials, display and memory technologies, silicon and compound semiconductors, and advanced packaging, including a 3D packaging facility coming up in Odisha.
#SEMICON India 2026
#SEMICON 2.0
#Ashwini Vaishnaw
#semiconductor India
#chip design startups
#semiconductor manufacturing
#chip packaging
#semiconductor investment
#3D packaging Odisha
#India semiconductor ecosystem
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